Low dielectric losses enable accurate imaging​​ • Good temperature resistance and minimal water absorption • Non-brittle material and chipping resistance • Batch-to batch-stability​ • Allows large size and complex designs​ • Size reduction of components, thanks to ​high Dk PREPERM materials are a perfect fit in imaging lenses or as a radome (protecting cover) or as a combination of these two. PREPERM™ H Dielectric constant PREPERM™ Radome PREPERM™ High-temp PREPERM™ Flexible PREPERM™ Standard Grades for reflow soldering, temperature resistance for films and cables for ceramic replacement 2 7 12 17 22 Copyright © 2022, Avient Corporation.

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