Any samples or developmental material provided by Seller are provided “AS IS” with no warranty as to its performance and such samples or materials shall not create any warranty by sample, which is hereby waived. The sale of Products or the providing of samples or developmental material shall not, by implication or otherwise, convey any license under any intellectual property right relating to the compositions and/or applications of the Products, sample, or developmental material, as applicable. Buyer shall not use Seller’s name or trademarks in any advertisements, product descriptions, packaging materials, websites, or any other promotional materials, except with the prior written consent of Seller. 18.

SEMICONDUCTOR PACKAGING OEM S P E C I A L T Y , S T A T I C D I S S I P A T I V E P A C K A G I N G • Provide protection against electrostatic discharge (ESD) and environmental variations • Ensure highly specialized, clean manufacturing conditions • Deliver stringent quality control of ionic and metal contamination • Maintain availability of raw materials across a global supply chain • Ability to translate production globally • Protected critical electronics from ESD while providing an environmental barrier • Adhered to strict quality and cleanliness controls from raw material handling through production to help maintain high-purity standards, such as ultra-clean feeders, deionized water, and specific HVAC systems, supporting quality initiatives, including PCS reviews, eCoA, and HA assessments • Exceeded customer expectations for controlling ionic and metal contamination down to parts per billion (PPB) • Offered global capabilities with local support and material supply to meet growing semiconductor industry needs Stat-Tech Static Dissipative Formulations KEY REQUIREMENTS WHY AVIENT?

Helps reduce the quantity of raw material used, and the weight of the cable. Reduces material inventory and allows the use of general purpose resins. Processing conditions can cause material properties to shift from the values stated in the information.

These materials utilize long fiber technology and exhibit enhanced shielding effectiveness versus standard short fiber conductive polymers. TEMPERATURE Material Rear Center Front Nozzle Melt Mold Nylon 6,6 540–570 530–560 530–560 540–570 540–570 200–300 (90–150) Nylon 6,6 30% SS 540–570 530–560 530–560 540–570 540–570 200–300 (90–150) PBT 510–410 (265–280) 490–540 (255–280) 480–530 480–530 480–530 150–250 (65–120) PC 14% NiCF 540–570 540–570 530–560 530–560 530–560 150–250 (65–120) ABS 470–520 460–520 460–520 460–530 (240–275) 460–530 (240–275) 100–200 (40–90) PP 440–480 (225–250) 440–480 (225–250) 430–470 (220–245) 420–460 (215–240) 420–460 (215–240) 125–175 (50–80) DRYING Material Temperature °F (°C) Time Minimum Moisture Maximum Moisture Nylon 6,6 14% NiCF 180 (80) 4–5 hours 0.05% 0.20% Nylon 6,6 30% SS 180 (80) 4–5 hours 0.05% 0.20% PBT 14% NiCF 250 (120) 6-8 hours 0.02% 0.03% PC 14% NiCF 250 (120) 3–4 hours 0.02% 0.02% ABS 14% NiCF 200 (90) 2–4 hours 0.05% 0.10% PP 14% NiCF 180 (80) 2–4 hours 0.20% 0.30% Equipment • Feed throats smaller than 2.5" may cause bridging due to pellet size - Larger feed throats will be more advantageous with long fiber EMI shielding resins • General purpose metering screw is recommended - Mixing/barrier screws are not recommended • L/D ratio - 18:1–20:1 (40% feed, 40% transition, 20% metering) • Low compression ratio - 2:1–3:1 • Deep flights recommended - Metering zone 3.5 mm - Feed zone 7.5 mm • Check ring - Three-piece, free-flowing check ring • General purpose nozzle (large nozzle tips are recommended) - Minimum orifice diameter of 7/32" - Tapered nozzles are not recommended for long fiber EMI shielding resins • Clamp tonnage: - 2.5–5 tons/in2 Gates • Large, free-flow gating recommended - 0.25" x 0.125" land length - 0.5" gate depth Runners • Full round gate design • No sharp corners • Minimum of 0.25" diameter • Hot runners can be used PROCESSING Screw Speed Slower screw speeds are recommended to protect fiber length Back Pressure Lower back pressure is recommended to protect fiber length Pack Pressure 60–80% of max injection pressure Hold Pressure 40–60% of max injection pressure Cool Time 10–30 seconds (depends on part geometry and dimensional stability) PROCESS CONSIDERATIONS Recommended – retain fiber length (maximize conductivity) • Low shear process • Low screw speed and screw RPM • Slow Injection speed • Fill to 99–100% on first stage of injection - Reduces potential nesting of fibers at gate location - Improves mechanical performance near gate location - Promotes ideal fiber orientation Resin Rich Surface • Achieved when using a hot mold temperature and longer cure times ≥ Max mold temperature recommendation • Improved surface aesthetic • Reduced surface conductivity • Could reduce attenuation performance in an assembly Fiber Rich Surface • Achieved when using a cold mold temperature and shorter cure times ≤ Minimum mold temperature recommendation • Improved surface aesthetic • Reduced surface conductivity • Could improve attenuation performance in an assembly www.avient.com Copyright © 2020, Avient Corporation. Processing conditions can cause material properties to shift from the values stated in the information.

TECHNICAL BULLETIN PREPERM™ and Edgetek™ Low-Loss Dielectric Thermoplastics The PREPERM™ and Edgetek™ dielectric portfolios have been specially formulated to meet application demands for materials that enable faster and more reliable connections at high-band 5G frequencies (mmWave). With a dielectric constant (Dk) range spanning 2.55 to 23, these materials are optimized to boost antenna efficiency and deliver lightweight solutions for 5G infrastructure and devices. Processing conditions can cause material properties to shift from the values stated in the information.

GUIDELINES FOR USING CESA CLEAN ADDITIVES • Cesa Clean works best when molded maintaining normal (injection) pressure/shear • For best results, Avient recommends a “Running Color Change” which eliminates breaks in the molding cycle • Since the Cesa Clean concentrate will expand, it is recommended to reduce the shot size by 20% • It is designed for use at a let-down ratio (LDR) of 3.0% or (33:1); however, use rate can vary depending on the severity of the contamination but typically is 2.0–4.0% (a use rate higher than 6.0% may not have any positive affect on the cleaning performance) • Using Cesa Clean as a routine part of your color change rotation will allow faster changes and consume a minimal amount of raw material - Note: If the manifold is not cleaned routinely, this process may be more time consuming and additional material will be required • It is best to process at your normal polymer processing temperatures - For best performance, stock temperature should be at least 400°F - If 400°F is achieved during the purging process, no additional activation will occur during the reprocessing of regrind - All parts produced during the “Running Purge Cycle” should be captured as regrind, resulting in a scrap-free color change - If using sequential gates, open and close all gates at the same time while purging the tool - If contamination appears to be coming from one gate, open and close first, and for an extended period of time, to force more material through this location - When cleaning in this manner, pay close attention to shot size - Parts containing the previous or new color plus any Cesa Clean can be used as regrind INTRODUCING CESA CLEAN TO YOUR PROCESS Hand Blend • Hand weigh enough of the Cesa Clean and natural resin mix to equate to 3–5 times the barrel capacity • Use rate should be 3.0% or 33:1 for routine cleaning • For difficult-to-clean tooling, or tooling which is not routinely cleaned, start at 4.0% or 25:1 • Note: Do not attempt to vacuum load more than 15 feet from source as stratification/separation may occur Volumetric Feeder • Calibrate feeder to dispense 3.0% or 33:1 for routine cleaning • For difficult-to-clean tooling, or tooling which is not routinely cleaned, start at 4.0% or 25:1 • This style of feeder is highly recommended for at-the-throat metering of Cesa Clean Blending Units Most blenders have an extra bin for an additive • Fill the additive bin with Cesa Clean • Set blender to introduce the Cesa Clean at 2.0 to 4.0% • Note: Do not air convey any further than 15 feet as Cesa Clean has a high density and may separate from the mix. Processing conditions can cause material properties to shift from the values stated in the information.

Once opened the pump connects seamlessly to the FlexOne drive motor and additional features of RFID tagging are available to track material usage. Q/P units come with touch screen interface systems and a range of additional technology features for more complex material handling needs. Processing conditions can cause material properties to shift from the values stated in the information.

Following Avient’s internal procedures for identifying, reducing, and managing hazardous materials and substances of very high concern (SVHC) in our products Protecting our associates, neighbors and the environment in the communities in which we operate, by understanding the health and environmental impact of our raw materials and products where hey are manufactured or used

Microsoft Word - IATF 16949 North Baltimore[80].doc ABS Quality Evaluations Certificate Of Conformance This is to certify that the Quality Management System of: Avient Corporation Engineered Materials Division Avient Corporation 733 E. Page 1 of 2 ABS Quality Evaluations IATF 16949:2016 Certificate Of Conformance ANNEX Certificate No: IATF No: 38972 0422162 Avient Corporation Engineered Materials Division At Below Facilities: Facility: Corporate 33587 Walker Road Avon Lake, OH 44012 U.S.A.

By applying our technology and experience, we can help you to enhance these materials with color, additives and fibers. We use our proven expertise in formulating high temperature thermoplastics to create formulations based on materials that include: • PEEK • PSU • PEI • LCP • PES • PPS • PPSU These specialty formulations give manufacturers confidence in the reliability and durability of their products. Processing conditions can cause material properties to shift from the values stated in the information.