Avient’s Foaming Prediction Service uses 3D simulation software to help predict weight reduction, cycle time, and the mechanical properties of automotive parts foamed with Hydrocerol™ Chemical Foaming Agents. Explore 3D Printing 3D printing is having an impact on our world - learn how it can impact your business today

3D/LDS Technology: Edgetek™ Solutions Edgetek 3D/LDS solutions are advanced technologies to help customers produce 3D Molded Interconnect Devices (MID) for antenna products

3D Printing & Rapid Prototyping

Edgetek™ LDS及3D立体电路配方使客户能够在有限空间内实现选择性金属化电路设计。 此种材料有助于提高 设计灵活性，尤其是在3D天线设计和复杂形状方面。 ET9600-8010 LDS ET3200-8177 LDS基础树脂 产品牌号 基础树脂 Dk Df ET9600-8010 LDS BK001 LCP 4 0.006 280+ ℃ ET9600-8015 3D BK001 LCP 3.9 0.004 270+ ℃ ET9600-8018 3D BK001 LCP 3.44 0.004 250+ ℃ ET9600-8022 3D BK001 LCP 3.06 0.004 250+ ℃ ET7600-8047 3D NC001 PPE 2.6 0.002 No ( SMT ) ET7600-8052 3D NC001 PPE 4.5 0.004 No ( SMT ) ET7600-8040 3D RS NC001 PPE 6 0.002 No ( SMT ) ET7600-8043 3D RS NC001 PPE 9 0.004 No ( SMT ) ET3200-8205 3D BK001 PC 2.95 0.006 No ( SMT ) ET3200-8207 3D BK001 PC 2.95 0.006 No ( SMT ) ET3200-8198 3D BK001 PC 3.2 0.006 No ( SMT ) LCP PPE PC 焊接能力 EDGETEK LDS 系列产品：™ 普立万EDGETEK LDS及3D立体电路配方在5G基站天线应用方面具有以下优势： • 提高设计灵活性 ‒ 有助于提高设计灵活性，尤其是在电路设计、3D天线设计和复杂形状方面 • 加快设计确认效率，缩短交货周期 ‒ 可根据特定的Dk值进行定制，并在数周内交付 • 灵活的设计空间 ‒ 有助于优化受空间限制的电路设计 • 与SMT工艺兼容 ‒ 可提供具有耐热性的定制配方，抗热变形温度范围为200℃-278℃ 如需了解更多详情，请访问 www.avient.com 或致电 +86 021 60294888 ， 能可 的数 www.avient.com 版权所有©2020埃万特公司。

PolyOne also will present an update to the unique 3D-MID (three dimensional molded interconnect device) manufacturing technology it highlighted at its stand during Fakuma 2014. By collaborating, PolyOne and selected developers have succeeded in establishing a time- and cost-saving means to produce the 3D-MIDs serving as heat sinks in LED lighting, which could prove an alternative to the complex printed circuit boards now fairly ubiquitous in these applications.

Edgetek™ 3D/LDS Solutions - Product Bulletin (Chinese) Advanced technologies to help customers to build 3D circuits on molded part surfaces (Chinese language version) Edgetek™ 3D/LDS Solutions - Product Bulletin (English)

Edgetek™ 3D/LDS Solutions Advanced PC, PPS and LCP formulations to help customers to build 3D circuits on molded part surfaces; supporting high design flexibilty, multi-function integration, size miniaturization and weight reduction, even in high heat processes such as SMT Customizable polymeric materials to meet specific Dk (Dielectric Constant) /Df (Dissipation Factor) values, including formulations that are compatible with the surface-mount technology (SMT) process and can be used to create 3D circuit boards for 5G equipment.

These materials increase design flexibility, particularly for 3D antenna designs and complex shapes. ET9600-8010 LDS ET3200-8177 LDS Dielectric Constant (DK) 3.98 2.88 Dissipation Factor (Df) 0.0060 0.0040 SPECIALTY ENGINEERED MATERIALS ELECTRICAL & ELECTRONICS SOLUTIONS EDGETEK™ FORMULATIONS FOR 5G BASE STATION ANTENNA APPLICATIONS EDGETEK™ PRODUCT PORTFOLIO HOW AVIENT EDGETEK FORMULATIONS MAKE THE DIFFERENCE FOR 5G BASE STATION ANTENNA APPLICATIONS Increased Design Flexibility – Can increase design flexibility especially for circuit design, 3D antenna design, and complex shapes Faster Design Qualification & Shorter Lead Time – Can be customized to specific Dk values and delivered within weeks Flexible Design Space – Effective for circuit designs constrained by a limited space Compatible with SMT Process – Can be customized to resist heat, with deflection temperatures ranging from 200°C to 278°C To learn more, please visit www.avient.com or call +86.21.60284888.

Source: https://pbipolymer.com/ https://www.engineering.com/3DPrinting/3DPrintingArticles/ArticleID/14465/3D-Printing-Filam https://www.engineering.com/3DPrinting/3DPrintingArticles/ArticleID/14465/3D-Printing-Filam https://pbipolymer.com/ Source: https://www.solvay.com/sites/g/files/srpend221/files/2018-11/Additive-Manufacturing-Filaments-Processing-Guide_EN-v1.1_0.pdf BRASS OR STEEL DIE? PROCESSING OPTIONS Additive Manufacturing Many companies are producing 3D printed parts from high-performance polymers for specialized aerospace, medical and industrial applications. These materials can be 3D printed using selective laser sintering (SLS) and fused filament fabrication (FFF).

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