SANDALWOOD ASA UV

ASA CHARCOAL DOOR

ASA

+358 (0)29 509 5000 registry@prh.fi Page: 1 (2) Business ID: 2046676-4 Date and time of creating the document: 01.12.2020 08:37:55 TRANSLATION OF THE EXTRACT FROM THE TRADE REGISTER, ELECTRONIC 01.12.2020 08:37:54 the details in the register Identifiers Name Avient Finland Oy Business ID 2046676-4 Entered in the register 31.03.2007 Company type Limited company Contact details: Postal address Äyritie 8 E 01510 Vantaa Street address Äyritie 8 E 01510 Vantaa Email tina.ahlquist@clariant.com Telephone 0106808500 Fax 0106808509 Name details Name Avient Finland Oy Auxiliary company name Drycolor Registered office Vantaa Share capital Share capital 169.000,00 € Number of shares 1 000 pcs Nominal value of a share 169,00 € Financial period Financial period 01.01 - 31.12 Financial statements The last financial statements submitted 01.01.2019 - 31.12.2019 Representation Page: 2 (2) Business ID: 2046676-4 Statutory representation: Under the law, the Board of Directors represents the company.

SEMICONDUCTOR PACKAGING OEM S P E C I A L T Y , S T A T I C D I S S I P A T I V E P A C K A G I N G • Provide protection against electrostatic discharge (ESD) and environmental variations • Ensure highly specialized, clean manufacturing conditions • Deliver stringent quality control of ionic and metal contamination • Maintain availability of raw materials across a global supply chain • Ability to translate production globally • Protected critical electronics from ESD while providing an environmental barrier • Adhered to strict quality and cleanliness controls from raw material handling through production to help maintain high-purity standards, such as ultra-clean feeders, deionized water, and specific HVAC systems, supporting quality initiatives, including PCS reviews, eCoA, and HA assessments • Exceeded customer expectations for controlling ionic and metal contamination down to parts per billion (PPB) • Offered global capabilities with local support and material supply to meet growing semiconductor industry needs Stat-Tech Static Dissipative Formulations KEY REQUIREMENTS WHY AVIENT?

BASE RESIN PPA PC PSU PES PPS CO- POLYMER ACETAL PEEK PA Barrel Temperatures* °F (°C) Rear Zone 550–580 (288–305) 520–560 (271–293) 600–640 (316–338) 630–660 (332–338) 550–580 (288–304) 350–370 (177–188) 660–700 (349–371) 440–490 (227–254) Center Zone 560–600 (293–316) 530–570 (277–299) 620–670 (327–354) 650–680 (343–360) 560–615 (293–324) 380–390 (193–200) 700–730 (371–388) 470–510 (243–266) Front Zone 580–620 (304–327) 550–580 (288–305) 630–680 (332–360) 670–730 (354–388) 590–630 (310–332) 390–430 (200–221) 720–750 (382–400) 490–540 (254–282) Nozzle 575–615 (302–324) 550–600 (288–316) 630–680 (332–360) 680–700 (360–371) 600–625 (316–330) 380–415 (193–213) 720–750 (382–400) 520–570 (271–300) Melt Temperature 575–615 (302–324) 560–600 (293–316) 625–675 (330–358) 650–710 (343–377) 600–625 (316–330) 370–410 (188–210) 670–740 (354–393) 520–570 (271–300) Mold Temperature 250–300 (121–150) 175–240 (80–116) 190–300 (88–150) 225–325 (107–164) 250–325 (121–164) 150–225 (66–107) 290–375 (143–190) 150–200 (66–93) Pack & Hold Pressure 50%–75% of Injection Pressure Injection Velocity in/s 1.0–3.0 Back Pressure psi 50 Screw Speed rpm 50–90 Drying Parameters °F (°C) 6 hrs @ 175 (80) 4 hrs @ 250 (121) 4 hrs @ 275 (135) 4 hrs @ 300 (150) 4 hrs @ 250 (121) 2 hrs @ 200 (93) 3 hrs @ 300 (150) 4 hrs @ 180 (82) Allowable Moisture % < 0.05 < 0.02 < 0.02 < 0.04 < 0.02 0.15–0.20 < 0.02 0.10–0.20 Cushion in 0.125–0.250 Screw Compression Ratio 2.5:1–3.5:1 2.0:1–2.5:1 2.5:1–3.5:1 2.5:1–3.5:1 2.5:1–3.5:1 2.5:1–3.5:1 2.5:1–3.5:1 2.5:1–3.5:1 Nozzle Type General General General General General General General Reverse Taper Clamp Pressure 5–6 Tons/in2 of projected area of cavities and runner system * Barrel temperatures should be elevated for compounds designed for electrical insulative properties. Cut vent depths to: - PPA Compounds: 0.0015"–0.0025" depth and 0.250" width - PC Compounds: 0.002"–0.004" depth and 0.250" width - PSU Compounds: 0.003"–0.004" depth and 0.250" width - PES Compounds: 0.003"–0.004" depth and 0.250" width - PPS Compounds: 0.002"–0.003" depth and 0.250" width - Acetal Compounds: 0.0015" minimum depth and 0.250" width - PEEK Compounds: 0.002"–0.004" depth and 0.250" width - Nylon Compounds: 0.002" minimum depth and 0.250" width • Increase vent depth to 0.060" (1.5mm) at 0.250" (4.0mm) away from the cavity and vent to atmosphere.

Base Resin PPA PC PSU PES PPS Co- polymer Acetal PEEK PA Barrel Temperatures* °F (°C) Rear Zone 550–580 (288–305) 550–590 (288–310) 600–640 (316–338) 630–660 (332–338) 550–580 (288–304) 350–370 (177–188) 660–700 (349–371) 440–490 (227–254) Center Zone 560–600 (293–316) 570–600 (300–316) 620–670 (327–354) 650–680 (343–360) 560–615 (293–324) 380–390 (193–200) 700–730 (371–388) 470–510 (243–266) Front Zone 580–620 (304–327) 580–630 (304–322) 630–680 (332–360) 670–730 (354–388) 590–630 (310–332) 390–430 (200–221) 720–750 (382–400) 490–540 (254–282) Nozzle 575–615 (302–324) 580–630 (304–322) 630–680 (332–360) 680–700 (360–371) 600–625 (316–330) 380–415 (193–213) 720–750 (382–400) 520–570 (271–300) Melt Temperature 575–615 (302–324) 580–625 (304–330) 625–675 (330–358) 650–710 (343–377) 600–625 (316–330) 370–410 (188–210) 670–740 (354–393) 520–570 (271–300) Mold Temperature 250–300 (121–150) 175–240 (80–116) 190–300 (88–150) 225–325 (107–164) 250–325 (121–164) 190–250 (88–121) 290–375 (143–190) 150–200 (66–93) Pack & Hold Pressure 50%–75% of Injection Pressure Injection Velocity in/s 1.0–3.0 Back Pressure psi 50 Screw Speed rpm 50–90 Drying Parameters °F (°C) 6 hrs @ 175 (80) 4 hrs @ 250 (121) 4 hrs @ 275 (135) 4 hrs @ 250 (121) 3 hrs @ 300 (150) 2 hrs @ 200 (93) 3 hrs @ 275 (135) 4 hrs @ 180 (82) Cushion in 0.125–0.250 Screw Compression Ratio 2.5:1–3.5:1 2.0:1–2.5:1 2.5:1–3.5:1 2.5:1–3.5:1 2.5:1–3.5:1 2.5:1–3.5:1 2.5:1–3.5:1 2.5:1–3.5:1 Nozzle Type General General General General General General General Reverse Taper Clamp Pressure 5–6 Tons/in2 of projected area of cavities and runner system * Barrel temperatures should be elevated for compounds designed for electrical insulative properties. Cut vent depths to: - PPA Compounds: 0.0015"–0.0025" depth and 0.250" width - PC Compounds: 0.002"–0.004" depth and 0.250" width - PSU Compounds: 0.003"–0.004" depth and 0.250" width - PES Compounds: 0.003"–0.004" depth and 0.250" width - PPS Compounds: 0.002"–0.003" depth and 0.250" width - Acetal Compounds: 0.0015" minimum depth and 0.250" width - PEEK Compounds: 0.002"–0.004" depth and 0.250" width - Nylon Compounds: 0.002" minimum depth and 0.250" width • Increase vent depth to 0.060" (1.5mm) at 0.250" (4.0mm) away from the cavity and vent to atmosphere.

In addition to PA66, our solutions also can be customized using multiple base resins such as PC and PBT to meet specific customer needs.

Edgetek 3D/LDS Solutions can be formulated in PC, LCP, PPS and be customized to meet customers’ specific needs.

Cesa laser marking solutions can be used with a variety of thermoplastics including, but not limited to: • PP • PC/ABS • Polyamide • Polyacetal (POM) Applications include: • Traceability, UPC, Branding • Food Packaging Lot Codes • Industrial Safety Tags & Equipment • Wire & Cable Part Numbers & Gauge Size • Automotive Components • PE • PET • PMMA • Polyolefins PRODUCT BULLETIN WHY LASER MARKING?