https://www.avient.com/sites/default/files/2020-10/tpe-overmold-design-guide.pdf
Not all GLS™ TPEs will bond to all types of substrates; for example, a Dynaflex™ TPE that bonds
to polypropylene (PP) will not adhere to polycarbonate (PC).
The Avient GLS™ Overmolding TPEs (Versaflex™ and Versollan™) are specially
formulated to bond to a variety of thermoplastics, including:
• Polycarbonate (PC)
• Acrylonitrile Butadiene Styrene (ABS)
• PC/ABS
• Standard and Modified* Nylon 6, Nylon 6/6, Nylon 6,6,6
• Copolyester
• Polystyrene (PS)
• High Impact Polystyrene (HIPS)
• PC/PETG
• Acetal (POM)
• Polyphenylene oxide (PPO)
• Alloys or blends of the above
*Glass-filled, impact-modified, and/or heat-stabilized versions.
Avient's GLS Overmolding TPEs (Versaflex™ and Versollan™) are specially
formulated to bond to a variety of thermoplastics, including:
• Polycarbonate (PC)
• Acrylonitrile Butadiene Styrene (ABS)
• PC/ABS
• Standard and Modified* Nylon 6, Nylon 6/6, Nylon 6,6,6
• Copolyester
• Polystyrene (PS)
• High Impact Polystyrene (HIPS)
• PC/PETG
• Acetal (POM)
• Polyphenylene oxide (PPO)
• Alloys or blends of the above
*Glass-filled, impact-modified, and/or heat-stabilized versions.
https://www.avient.com/investor-center/news/avient-expects-double-digit-sales-growth-5g-applications
PRNewswire/ -- 5G technology will provide the backbone for a step-change in performance of mobile devices, allowing ultrafast download speeds and the ability to connect billions of devices through a network.
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