https://www.avient.com/products/engineered-polymer-formulations/general-engineered-formulations/edgetek-engineered-polymer-formulations
Advanced PC, PPS and LCP formulations to help customers to build 3D circuits on molded part surfaces; supporting high design flexibilty, multi-function integration, size miniaturization and weight reduction, even in high heat processes such as SMT
https://www.avient.com/news/avient-brings-sustainable-innovation-npe-2024
Cesa™ Non-PFAS Process Aid for Extrusion: for use in polyethylene (PE) and polypropylene (PP) applications, it reduces friction between the polymer and the metal during extrusion comparable to a traditional processing aid but is formulated without fluoropolymers which may be classifiable as per- and polyfluorinated substances (PFAS) and will be presented during Avient’s technical seminar at NPE, “PFAS Alternatives: 2024 and Beyond,” by Sean Bernhardt, Senior Research and Development Manager, Color, Additives, & Inks, Americas at Avient, on May 7 at 3 p.m. and May 8 at 1 p.m.
